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Quiz - SMT (Surface Mount Technology)

Froggy Jumps

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Quiz - SMT (Surface Mount Technology)

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Quiz - SMT (Surface Mount Technology)
 

Froggy Jumps

Quiz - SMT (Surface Mount Technology)Online version

Quiz - SMT (Surface Mount Technology)

by Janaina Nobre da Costa
1

Durante o processo SMT, uma PCB de grande dimensão apresenta empenamento (warpage) excessivo durante a refusão. Qual é o principal impacto desse fenômeno?

2

O “Area Ratio” é um dos parâmetros mais importantes para transferência eficiente da pasta de solda através do stencil.

3

Um aumento repentino na ocorrência de solder bridges após a impressão geralmente está associado a:

4

Ao montar componentes de grande massa e tamanho, qual fator é mais crítico para evitar deslocamentos durante o transporte da máquina?

5

Qual condição abaixo tem maior probabilidade de gerar tombstoning em componentes chip (0402, 0201)?

6

O parâmetro TAL (Time Above Liquidus) representa:

7

Uma taxa de resfriamento excessivamente rápida após a refusão pode provocar:

8

Qual das situações abaixo mais contribui para aumento de falsos defeitos (False Calls) na AOI?

9

Qual tecnologia da AOI é normalmente utilizada para validação automática de polaridade e orientação?

10

Uma linha apresenta aumento simultâneo de: * Insufficient Solder; * Missing Components; * False Calls na AOI. Qual deve ser a primeira ação de engenharia?

11

Segundo a filosofia de processo SMT, qual equipamento tem maior influência na qualidade final da montagem?

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